There are many reasons to coat non-conductive substrates with metallic coatings. The following are a few benefits:
Reduce weight
Replace a metal component with a lightweight plastic component without losing conductivity.
Reduce cost
For example, replace a solid copper block with a copper plated hollow plastic block.
Improve appearance
Many coatings are very decorative such as gold, silver and nickel.
Durability
Some materials are very reactive and not well suited for certain environments and/or applications. A durable metallic coating often extends the lifetime and improves the performance of the component or assembly.
Electrical
To conduct electricity a conductive path is required. Metallic coatings offer a solution for non-conductive substrates.
Most industries use plated plastic parts. Non-conductive items are very popular in consumer markets such as automotive, entertainment, manufacturing and household goods. They are also used heavily in medical applications. INTA successfully plated many plastic components for the Apple iPod. The plastic components needed to be plated to aid subsequent joining operations.
Nickel
Copper
Silver
Gold
Platinum
Rhodium
Answers vary according to the specific application. For design assistance contact Blake Kneedler, Estimator 408-748-9955 x113.
In most cases, INTA Technologies strongly prefers to slightly roughen the surface prior to further treatment. If your part has a 4 finish specified, there could be a problem. 16 or 32 is more acceptable, 64 is preferred.
Yes, please send the drawings to contact@intatech.com for review and feedback.
In many cases, thick
film metallization utilizes a Moly-Manganese (MoMn) refractory ink specifically
designed for oxide ceramic bodies to provide one of the industries strongest
bond strengths. Other formulations are also used by INTA, especially silver and
silver-palladium. Inks can be applied
by screen printing, roll printing, hand painting, air brush spraying, immersion
and centrifugal coating.
Inks are fired onto the ceramic at approximately 1300-1400 degrees C. in a
hydrogen/nitrogen controlled atmosphere (INTA owns and operates several
hydrogen atmosphere furnaces) in the case of MoMn. Silver inks are fired in one
of INTA's air furnaces. The glass phases in the MoMn metallization bonds with
the glass phases in the ceramic yielding peel strengths of 10-20 pounds. The
metallized surface is now electrically conductive. Typically the surface is
sulfamate or electroless nickel boron plated to help provide a more
"wettable" surface during sequential brazing or soldering operations.
Plating is performed
with chemicals and liquid baths. In
terms of direct plating on non-conductive substrates, the coating adhesion is
generally less robust on plated parts in comparison to parts metallized with a
thick film. The adhesion is usually
less robust due to the nature and science of the deposit.
Many thick film
coated parts are subsequently plated.
In summary, thick film and plating are two methods to coat
non-conductive materials. In general,
thick film provides more robust adhesion.
Plating often follows thick film coating. Plating directly on non-conductive substrates is common and very
useful.
Most non-conductive materials are suitable. Some key characteristics to look for include:
Max rated temperature 200 deg C or higher is preferred
Porosity fully dense or fully porous material preferred
Surface finish 16-32 or higher finish preferred
Mold release prefer absence of mold release material
In general, ABS and many types of plastic, glass and ceramic
are suitable. Avoid materials that
contain the following:
Lead
Mercury
Hexavalent chromium
Polybrominated diphenyl ether
Polybrominated biphenyl
Cadmium
Contact B.Kneedler, Engineering Estimator for assistance. 408-748-9955 x113
Prices vary. Request a quote by sending a detailed email to contact@intatech.com
To minimize costs reduce selective plating, reduce masking, reduce precious metal thickness requirements and increase volume.
Nickel
Tin
Silver
Gold
Platinum
Rhodium
Yes.
Yes.
Yes.
DFM or DfM stands for design for manufacturability. To reduce unnecessary delay and speed time to market, designers, engineers, managers and technical staff should contact INTA Technologies early in the process for design review and feedback. DFM is a great way to ensure project success.
INTA plates on tungsten. INTA does not plate tungsten on other materials.
Yes.
INTA does not deposit titanium on other materials. INTA does, however, plate other metals (such as platinum) on titanium base materials.
Yes.
Contact:
Blake Kneedler, Engineering Estimator
2281 Calle de Luna
Santa Clara, CA 95054
408-748-9955 x113
408-727-3027 fax
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Last revised: 17 APR 2008