Many types of INTA coatings are used including:
Nickel
Silver
Copper
Gold
Platinum
Rhodium
Tin
One stop shopping – full component sourcing and fabrication from prototype to production including:
Services:
Sourcing
Machining
Brazing
Assembly
Testing
Kitting
Products:
Metallized ceramic
Machined components
Copper tungsten
Brazed components
Yes.
Yes.
Under normal circumstances - no. A small fee is generally incurred.
Lead times vary. Allow at least two to three weeks for manufacturing components from scratch in most cases.
INTA has been in business many years and emphasizes quality. When sending your RFQ please indicate a target price or project budget and INTA will do everything within its power to meet or exceed your target price.
Same day in certain cases. Expedite service costs extra, be sure to ask Customer Service Manager, Karen Cabral for more information kcabral@intatech.com
Partial list:
Copper
Steel
Copper tungsten
Graphite
Aluminum
Ceramic
Plastic
Molybdenum
Titanium
Zirconia
Kovar
Quartz
MACOR
Inconel
Alloys
Quartz
Yes, ISO 9001:2000 certified since 2006. Please see http://www.intatech.com/files/INTA_Technologies_ISO_9001-2000_Certificate.pdf for further details.
Quality
On-time delivery
Yes, INTA has successfully plated wafers although it is not our specialty.
INTA has successfully assembled and plated many octupoles and similar components. It is not a large portion of our revenue stream but it is something we do very well. We also plate pre-assembled octupoles.
Heat sinks are important to avoid overheating essential components. Heat sinks remove heat from critical components.
INTA manufactures copper, copper tungsten and aluminum heat sinks. The most common are copper and copper tungsten. Other heat sinks can be built-to-order.
Diamond has a very high rate of thermal conductivity. Other good materials include:
Silver
Copper
Gold
Silicon Carbide
BeO
Aluminum
Al-N
Tungsten
AlSiC
CuW
Silicon
CuMo
Molybdenum
The best heat sink depends on a given application. For high temperature applications, a high temperature material such as CuW is preferred. Pricing is also a factor, diamond and gold are very expensive. Contact INTA for design assistance. contact@intatech.com
Heat sinks are often plated to help protect the material and to aid subsequent bonding. Popular choices include nickel, silver and gold. Not all heat sinks need plating, the answer is application specific.
It depends on the subsequent processes. For AuGe or AuSn braze operations, the heat sink should be gold plated. If a AgSn solder is planned, perhaps tin or silver is in order. Nickel boron is another optional coating which promotes good solder and braze joints.
CuW, also called copper tungsten, tungsten copper and W-Cu, is a powdered metal product consisting of a mixture of copper and tungsten (a.k.a. wolfram). It is a refractory metal used for many purposes such as heat sink and thermal management applications. There are several common grades including:
W/Cu
75/25
80/20
85/15
90/10
90/10 copper tungsten is the most costly and 75/25 is the least. CuW is used for EDM electrodes. INTA sells CuW electrodes, raw CuW blanks and machined CuW components built to customer specification. INTA also offers plating and brazing of CuW. The material is unique and many plating companies have difficulty plating CuW due to the material properties but INTA has perfected their processes over the past years. Since 1978 INTA has been working on coatings and surface engineering projects. CuW was added to the INTA Technologies product line within the last decade.
Yes, INTA offers assembly services. INTA does not do pick and place or board-level assembly but does offer brazed and soldered assemblies built to customer specification. Customers may supply all the subcomponents or ask INTA to supply the materials. Some assemblies contain almost one hundred sub-components, but typical assemblies are much simpler with only 2-10 components. INTA is ISO 9001:2008 certified and performs rigorous inspections, qualifications and documentation.
Yes, INTA Machining and INTA Technologies Corporation are contract manufacturers.
Ground bounce is a momentary potential difference, or voltage, between the PCB ground and an IC ground. Usually in this situation, the IC ground has a greater potential in comparison to the PCB ground.
Ground bounce can be caused by many factors but the most common cause is an output pin on an IC switching from high to low. The potential difference is increased when multiple output pins switch simultaneously.
Ground bounce can play a role in incorrect data conversion. If the IC ground is artificially high due to bouncing, a high signal could be interpreted as low because the threshold voltage of the IC input buffer could rise above the actual input voltage. In particular, multiple IC synchronous systems are vulnerable. There is a potential for a ground bounce to be coupled into the clock input which could result in extra clock edges as seen by the IC. The extra clock edges disrupt signal processing and corrupt data.
Yes.
Yes.
The decoupling capacitor should have a very short trace to the PCB ground plane because the DC drives the IC using the current drawn from the PCB ground plane. For high frequency applications or when fast switching at the output nodes is needed, long traces would slow the performance because the output node capacitance is charged by means of the DC. The ground pin trace for any IC should have a direct and short connection to the PCB ground plane because the DC’s current flow is on the recovered current.
INTA can help with ceramic PCB’s. INTA offers short lead times and competitive pricing. INTA does not offer flexible circuit boards, only metallized ceramic substrates with customer-supplied patterns on one or two sides. INTA also offers soldering and brazing services but not board level assembly.
Decoupling capacitors are typically found on circuit boards near IC’s or other active components. The capacitor reduces the HF (high frequency) impedance of the power supply (as seen by the IC). The apparent impedance is raised by the inductance of PCB traces, connectors and other cables. The result can be the alternating currents drawn by one IC to be seen by other adjacent IC’s or active components as supply voltages deltas. At the end of the day, signal integrity can be degraded. Decoupling capacitors help eliminate these difficulties. INTA Technologies Corp. supplies metallized ceramic printed circuit boards. The PCBs manufactured by INTA are typically made-to-order aluminum oxide (alumina, Al-O or Al2O3), aluminum nitride (Al-N) or beryllium oxide (BeO). Our customers supply a drawing of the trace layout complete with pads for components such as decoupling capacitors. INTA can provide ceramic PCBs with silver traces. The silver works well for AgSn solder applications. For other options or details contact INTA Technologies.
Circuit Cellar Magazine
Global Semiconductor Alliance
Quality Magazine – manufacturing excellence
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Last revised: 16 JUL 2010
