Electroplating & Electroless Plating Services

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Electroplating & Electroless Plating

Offering electroplating and electroless plating of precious metals on a wide variety of substrate materials, INTA produces industrial components with exceptionally high-quality coatings. Our choice of electroplating materials includes soft and hard gold, nickel, silver, copper, platinum, rhodium, tin and palladium. INTA offers both electroless nickel boron and electroless nickel phosphorus coatings. Substrates plated include a wide variety of metals and non-metallic materials such as plastics and ceramics.

Our process uses rack, barrel, and vibratory equipment which have computer controlled and automated capabilities. Prior to plating, we perform substrate specific operations that include stripping, cleaning and etching to ensure excellent adhesion.

We work with parts that measure .020" to 20" long, .020" to 20" wide, and .020" to 18" high and produce plating with thicknesses that range from 20 micro-inches to 0.006". We also offer a sintering process which can be performed as a post plating operation. Quality is maintained through the utilization of optical microscopes for surface inspection as well as inspections for the verification of thickness, adhesion and bake qualities.

The electroplating and electroless plating capabilities of INTA Technologies are ideal for high-tech industries and high-tech products. To learn more, please refer to the table below or contact us directly.

Electroplating and Electroless Plating Capabilities

Electro-Plating Material	Gold (Soft / Hard) Nickel Silver Copper Platinum Rhodium Tin Palladium
Electroless Nickel Material	Phosphorus Boron
Substrate-Metal	Copper Tungsten Thermkon® Beryllium Copper Kovar® Stainless Steel Titanium Cold Iron Invar® Copper Moly Tungsten
Substrate-Non Metals	Plastics ABS PVC Delrin Urethane Ceramics Alumina Beryllium Oxide Silicon Carbide Silicon Nitride Aluminum Nitride Steatite
Processes	Electroplating Electroless Plating
Equipment	Rack Barrel Vibratory
Automation Capabilities	Computer Controlled Process Automated
Pre-Plate Operations Specific to substrate to ensure excellent adhesion.	Stripping Cleaning Etching
Postplate Operations	Sinter
Plating Thickness	20 micro-inches to 0.006 inches
Part Length	.020 to 20 in
Part Width	.020 to 20 in
Part Height	.020 to 18 in
Inspection	Optical Microscopes (Surface)
Testing Ability	Thickness Adhesion Bake
Additional Services	Rework Recovery
Production Volume	1 to 10,000,000 Prototype to Production

Additional Information

Industry Focus	Medical & Life Science Aerospace & Military Automotive Green Energy Power Generation Analytical Instruments Machine Shops and Etching Companies Electronics & Semiconductor Lasers & Sound Telecommunications, RF, X-Ray & Microwave Oil & Gas Vacuum Applications & Other
Intended Applications	Vacuum Electron Device Bio-Compatible Implantable Devices
Industry Standards	AS 9100-C Certified ISO 9001:2008 Certified ITAR ASTM Mil-Spec AMS RoHS