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Electroplating & Electroless Plating Services

Electroplating & Electroless Plating
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Electroplating & Electroless Plating
 

Offering electroplating and electroless plating of precious metals on a wide variety of substrate materials, INTA produces industrial components with exceptionally high-quality coatings. Our choice of electroplating materials includes soft and hard gold, nickel, silver, copper, platinum, rhodium, tin and palladium. INTA offers both electroless nickel boron and electroless nickel phosphorus coatings. Substrates plated include a wide variety of metals and non-metallic materials such as plastics and ceramics.

Our process uses rack, barrel, and vibratory equipment which have computer controlled and automated capabilities. Prior to plating, we perform substrate specific operations that include stripping, cleaning and etching to ensure excellent adhesion.

We work with parts that measure .020" to 20" long, .020" to 20" wide, and .020" to 18" high and produce plating with thicknesses that range from 20 micro-inches to 0.006". We also offer a sintering process which can be performed as a post plating operation. Quality is maintained through the utilization of optical microscopes for surface inspection as well as inspections for the verification of thickness, adhesion and bake qualities.

The electroplating and electroless plating capabilities of INTA Technologies are ideal for high-tech industries and high-tech products. To learn more, please refer to the table below or contact us directly.

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Electroplating and Electroless Plating Capabilities

Electro-Plating Material Gold (Soft / Hard)
Nickel
Silver
Copper
Platinum
Rhodium
Tin
Palladium

Gold Tin

Electroless Nickel Material Phosphorus
Boron
Substrate-Metal Copper Tungsten
Thermkon®
Beryllium Copper
Kovar®
Stainless Steel
Titanium
Cold Iron
Invar®
Copper Moly
Tungsten
Substrate-Non Metals Plastics
  • ABS
  • PVC
  • Delrin
  • Urethane
Ceramics
  • Alumina
  • Beryllium Oxide
  • Silicon Carbide
  • Silicon Nitride
  • Aluminum Nitride
  • Steatite
Processes Electroplating
Electroless Plating
Equipment Rack
Barrel
Vibratory
Automation Capabilities Computer Controlled Process
Automated
Pre-Plate Operations
Specific to substrate to ensure excellent adhesion.
Stripping
Cleaning
Etching
Postplate Operations Sinter
Plating Thickness 20 micro-inches to 0.006 inches
Part Length .020 to 20 in
Part Width .020 to 20 in
Part Height .020 to 18 in
Inspection Optical Microscopes (Surface)
Testing Ability Thickness
Adhesion
Bake
Additional Services Rework
Recovery
Production Volume 1 to 10,000,000
Prototype to Production
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Additional Information

Industry Focus Medical & Life Science
Aerospace & Military
Automotive
Green Energy
Power Generation
Analytical Instruments
Machine Shops and Etching Companies
Electronics & Semiconductor
Lasers & Sound
Telecommunications, RF, X-Ray & Microwave
Oil & Gas
Vacuum Applications & Other
Intended Applications Vacuum Electron Device
Bio-Compatible Implantable Devices
Industry Standards AS 9100-C Certified
ISO 9001:2008 Certified
ITAR
ASTM
Mil-Spec
AMS
RoHS
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